Method for evaluating semiconductor substrate
AssigneeShin-Etsu Handotai Co., Ltd.
InventorTsuyoshi Ohtsuki
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AssigneeShin-Etsu Handotai Co., Ltd.
InventorTsuyoshi Ohtsuki
Estimating the term…
A method for evaluating electrical characteristics of a semiconductor substrate, the method including the steps of: forming a p-n junction on a surface of the semiconductor substrate; mounting the semiconductor substrate on a wafer chuck provided with an equipment for performing light irradiation on the surface of the semiconductor substrate and an equipment for measuring the quantity of the light for the irradiation; performing light irradiation on the surface of the semiconductor substrate for a predetermined time; and measuring an amount of carriers generated after the light irradiation of the p-n junction at least after turning off the light irradiation. This provides a method for evaluating a semiconductor substrate that allows the same evaluation in a wafer state as when an actual solid-state image sensor has been formed without producing a device by using process equipment when evaluating characteristics corresponding to residual image characteristics of a wafer.
A method for evaluating electrical characteristics of a semiconductor substrate, the method comprising the steps of:
Dependencies are inferred from the claim text.