Electrostatic chuck assembly for plasma processing apparatus
AssigneesBeijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
InventorsMaolin Long, Weimin Zeng
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AssigneesBeijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
InventorsMaolin Long, Weimin Zeng
Estimating the term…
An electrostatic chuck including a clamping layer having a first clamping electrode and a second clamping electrode is disclosed. A first clamping electrode defining a first clamping zone and a second clamping zone is provided. The first clamping zone and the second clamping zone are separated by a first gap and are electrically connected by at least one electrical connection extending across the first gap. A second clamping electrode disposed radially outward from the first clamping electrode. The second clamping electrode defining a third clamping zone and a fourth clamping zone that are separated by a second gap. The third clamping zone and the fourth clamping zone are electrically connected by at least one electrical connection extending across the second gap. Plasma processing apparatuses and systems incorporating the electrostatic chuck are also provided.
An electrostatic chuck, comprising:
A workpiece processing apparatus, comprising:
A system for processing workpiece, the system comprising:
Dependencies are inferred from the claim text.