Module tray for semiconductor device

A module tray for a semiconductor device, comprising:

• a case having a base plate, first and second sidewalls facing each other in a first horizontal direction on the base plate and defining an accommodation space, a plurality of first fastening grooves spaced apart from each other in a second horizontal direction orthogonal to the first horizontal direction on an inner surface of the first sidewall and respectively having first upper ends opened in a vertical direction, and a plurality of second fastening grooves spaced apart from each other in the second horizontal direction on an inner surface of the second sidewall and respectively having opened second upper ends;
• and
• an insert block configured to accommodate a semiconductor substrate that is inserted therein, the insert block having first and second fastening joints that have shapes corresponding to the first and second fastening grooves such that the first and second fastening joints are respectively inserted into and engaged with the first and second fastening grooves in the vertical direction.

A module tray for a semiconductor device, comprising:

• a case having a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, and first and second fastening grooves formed to respectively extend in the vertical direction on inner surfaces of the first and second sidewalls, the first and second fastening grooves having upper ends respectively opened to upper surfaces of the first and second sidewalls;
• and
• an insert block having a substrate accommodating space for accommodating a semiconductor substrate, the insert block detachably inserted into the first and second fastening grooves of the case, the insert block having first and second fastening joints extending in the vertical direction such that the first and second fastening joint are respectively inserted through the upper ends of the first and second fastening grooves, each of a plurality of holders respectively extending in the vertical direction from one of the first and second fastening joints, and a pair of side protrusions configured to press and fix the semiconductor substrate inserted and accommodated into the substrate accommodating space.