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AssigneeASML Holding N.V.
InventorsMehmet Ali Akbas, Tammo Uitterdijk, Christopher John Mason, Matthew Lipson, David Hart Peterson, Michael Perry, Peter Helmus, Jerry Jianguo Deng, Damoon Sohrabibabaheidary
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A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.
A method for reducing sticking of a wafer to a wafer support used in a lithography process, wherein the wafer support comprises a plurality of burls and each of the plurality of burls has a surface configured to support a back surface of the wafer, the method comprising:
A wafer support for use in a lithography process, the wafer support comprising:
Dependencies are inferred from the claim text.