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US 12,110,594 B2Granted
Composition for electroless platinum plating and electroless platinum plating method using the same
AssigneeFoundation of Soongsil University-Industry Cooperation
InventorsKuan Soo Shin, Jeong Hei Choi, Yoon Kyung Jung, Min Young Cho
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Abstract
The present invention relates to a composition for electroless platinum plating and an electroless platinum plating method using the same, wherein it is possible to easily and safely produce a uniformly dispersed platinum thin film without expensive additional equipment by performing electroless platinum plating with a composition for electroless platinum plating containing an alcohol, an aqueous solution of a platinum chloride compound, and an aqueous solution of a basic compound.
Claims4
An electroless platinum plating method, comprising:
- preparing a composition for electroless platinum plating, the composition consisting of:
- an alcohol;
- an aqueous solution of chloroplatinic acid (H2PtCl6) included in the composition at a concentration of 6.3 to 7.9 mM;
- and
- an aqueous solution of potassium hydroxide included in the composition at a concentration of 0.2 M;
- dipping a substrate in the composition;
- and
- shaking the composition at 100 to 200 rpm to form a platinum thin film on the substrate,
- wherein the substrate is selected from the group consisting of glass, rubber, ceramic, paper, carbon paper, wood, and leaves.
6 more elements
Dependencies are inferred from the claim text.