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US 12,014,942 B2Granted
Leak measurement system, semiconductor manufacturing system, and leak measurement method
AssigneeTokyo Electron Limited
InventorYuta Kunitake
Life of this patent
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Abstract
A leak measurement system measures a leak of a semiconductor manufacturing apparatus. The leak measurement system includes a vibration sensor that contacts or is connected to the semiconductor manufacturing apparatus, an image generation unit that generates a vibration waveform image based on vibration data detected by the vibration sensor, and an analysis unit that analyzes the leak of the semiconductor manufacturing apparatus based on the vibration waveform image generated by the image generation unit.
Claims18
A leak measurement system comprising:
- a vibration sensor that contacts or is connected to a semiconductor manufacturing apparatus;
- an imaging circuitry that generates a vibration waveform image based on vibration data detected by the vibration sensor;
- and
- an analyzing circuitry that analyzes a gas leak of the semiconductor manufacturing apparatus based on the vibration waveform image generated by the imaging circuitry, thereby measuring the gas leak of the semiconductor manufacturing apparatus based on vibration,
- wherein the analyzing circuitry includes:
- an image processing circuitry that generates a difference image of two vibration waveform images generated by the imaging circuitry;
- a calculation circuitry that calculates a difference ratio based on the difference image generated by the image processing circuitry;
- and
- a determination circuitry that determines whether there is a leak in the semiconductor manufacturing apparatus based on the difference ratio calculated by the calculation circuitry, and
- the difference ratio is calculated by a ratio of a non-matching area in the two vibration waveform images to an entire area of the difference image.
7 more elements
A semiconductor manufacturing system comprising:
- a semiconductor manufacturing apparatus;
- a vibration sensor that contacts or is connected to the semiconductor manufacturing apparatus;
- an imaging circuitry that generates a vibration waveform image based on vibration data detected by the vibration sensor;
- and
- an analyzing circuitry that analyzes a gas leak of the semiconductor manufacturing apparatus based on the vibration waveform image generated by the imaging circuitry, thereby analyzing the gas leak of the semiconductor manufacturing apparatus based on vibration,
- wherein the analyzing circuitry includes:
- an image processing circuitry that generates a difference image of two vibration waveform images generated by the imaging circuitry;
- a calculation circuitry that calculates a difference ratio based on the difference image generated by the image processing circuitry;
- and
- a determination circuitry that determines whether there is a leak in the semiconductor manufacturing apparatus based on the difference ratio calculated by the calculation circuitry, and
- the difference ratio is calculated by a ratio of a non-matching area in the two vibration waveform images to an entire area of the difference image.
8 more elements
A leak measurement method of measuring a leak of a semiconductor manufacturing apparatus, the method comprising:
- generating a vibration waveform image based on vibration data detected by a vibration sensor that contacts or is connected to the semiconductor manufacturing apparatus;
- and
- analyzing a gas leak of the semiconductor manufacturing apparatus based on the vibration waveform image generated in the generating of the vibration waveform image, thereby measuring the gas leak of the semiconductor manufacturing apparatus based on vibration,
- wherein the analyzing of the gas leak of the semiconductor manufacturing apparatus includes:
- generating a difference image of two vibration waveform images generated in the generating of the vibration waveform image;
- calculating a difference ratio based on the difference image;
- and
- determining whether there is a leak in the semiconductor manufacturing apparatus based on the difference ratio, and
- the difference ratio is calculated by a ratio of a non-matching area in the two vibration waveform images to an entire area of the difference image.
6 more elements
Dependencies are inferred from the claim text.