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US 12,010,814 B2Granted
Liquid immersion cooling sheet with improved surface structure
AssigneeTaiwan Microloops Corp.
InventorChun-Teng Chiu
Life of this patent
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Abstract
A liquid immersion cooling sheet includes a metal case and a porous structure. The metal case has a heated surface and a cooling surface formed on a back of the heated surface. The porous structure is disposed on the cooling surface and has multiple gaps. A width of each gap is less than or equal to about 0.2 mm. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.
Claims3
A liquid immersion cooling sheet, comprising:
- a metal case, comprising a heated surface and a cooling surface disposed on a back of the heated surface;
- and a porous structure, disposed on the cooling surface, comprising multiple gaps, and a width of each gap being between about 0.05 mm and about 0.1 mm, wherein the porous structure comprises multiple pins, and each of the multiple gap is disposed between any adjacent two of the multiple pins, wherein a width or a diameter of each pin is less than or equal to 0.2 mm.
Dependencies are inferred from the claim text.