Jet impingement cooling for high power semiconductor devices

A jet plate assembly for jet impingement cooling of a semiconductor device, comprising:

• a jet plate configured to be received within a heat exchange base and having a jet plate surface;
• and
• a jet pedestal formed on the jet plate and having at least one jet nozzle formed within a raised surface that is raised from the jet plate surface by at least one jet pedestal wall connecting the jet plate to the raised surface,
• wherein the jet plate, when received within the heat exchange base, defines a fluid flow path from an inlet chamber of the heat exchange base through the jet nozzle, and through a return path defined by the at least one jet pedestal wall to an outlet chamber of the heat exchange base,
• wherein the jet plate, when received within the heat exchange base, is attached to a chamber divider with the inlet chamber being adjacent to the jet plate and a first side of the chamber divider, and the outlet chamber being adjacent to a second side of the chamber divider, and with the jet plate surface being parallel with a bottom surface of the heat exchange base shared by the inlet chamber and the outlet chamber.

A method of making a jet impingement cooling assembly for semiconductor devices, comprising:

• forming a heat exchange base having a bottom surface;
• providing a chamber divider within the heat exchange base and attached to a jet plate having a jet plate surface that is parallel to the bottom surface, the chamber divider defining an inlet chamber that is adjacent to the jet plate and a first side of the chamber divider, and an outlet chamber that is adjacent to a second side of the chamber divider, the inlet chamber and the outlet chamber sharing the bottom surface;
• forming an inlet connection in fluid connection with the inlet chamber;
• and
• forming an outlet connection in fluid connection with the outlet chamber.