US 11,910,544 B2 · Assembly of printed circuit board with overmolded epoxy to baseplate

Abstract

A control unit having a connection structure for connecting components of the control unit to a base plate which eliminates the need for separate fasteners. The control unit includes circuitry mounted to a PCB, and the PCB is pre-assembled to a base plate, to form a pre-assembly. During assembly, the PCB and the base plate are aligned when placed in a tooling device which clamps and holds the pre-assembly in place during the over molding process. The circuitry is over molded with an epoxy material, such that the epoxy material flows from a top side of the PCB to underneath the base plate, and the PCB is fixed to the base plate without the use of fasteners such as screws, or adhesive materials.

Claims15

Dependent claims

An apparatus, comprising:

a control unit, including:
a base plate;
a printed circuit board (PCB) connected to the base plate;
circuitry mounted to the PCB;
at least one flow aperture integrally formed as part of the base plate;
and
an encapsulation housing including:
an epoxy overmolded around portions of the base plate, portions of the circuitry, and portions of the PCB,
a first layer disposed on a side of the PCB, and
a second layer disposed on a side of the base plate, the first layer and the second layer are connected together and connect the PCB to the base plate;
wherein the base plate and the PCB are connected together by the encapsulation housing, and
wherein at least a portion of the encapsulation housing is disposed in the at least one flow aperture, in between the first layer and the second layer.

9 more elements

A method for making a control unit, comprising the steps of:

providing a base plate;
providing a printed circuit board (PCB);
and
providing circuitry mounted to the PCB;
providing a connector shroud;
providing at least one circumferential flange being part of the connector shroud;
placing the PCB in contact with the base plate;
overmolding an epoxy around portions of the base plate, portions of the circuitry, and portions of the PCB to form an encapsulation housing which connects the base plate to the PCB;
mounting the connector shroud to the PCB in an area unoccupied by the encapsulation housing such that the at least one circumferential flange is in contact with the PCB, and a portion of the circuitry is surrounded by the connector shroud;
and
over molding the epoxy is around portions of the base plate and the PCB such that the at least one circumferential flange is disposed between a portion of the encapsulation housing and the PCB, securing the connector shroud to the PCB.

8 more elements

Dependencies are inferred from the claim text.

Assembly of printed circuit board with overmolded epoxy to baseplate

Life of this patent

Assembly of printed circuit board with overmolded epoxy to baseplate

Life of this patent

Abstract

Claims15