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US 11,895,810 B2Granted
Cooling arrangement
AssigneeABB Schweiz AG
InventorsJorma Manninen, Mika Silvennoinen, Joni Pakarinen
Life of this patent
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Abstract
A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.
Claims16
A power electronic assembly comprising:
- a power electronic module having multiple power electronic components and a cooling element, wherein the cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple vapour chambers arranged to transfer heat generated by the multiple power electronic components, wherein at least one vapour chamber of the multiple vapour chambers is arranged to transfer heat to another vapour chamber of the multiple vapour chambers;
- wherein the power electronic module comprises a substrate having an upper surface and a lower surface, wherein the multiple power electronic components are attached to the upper surface, and wherein at least one of the multiple vapour chambers is attached to the lower surface of the substrate.
A power electronic device comprising:
- a power electronic assembly including a power electronic module having multiple power electronic components and a cooling element, wherein the cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple vapour chambers arranged to transfer the heat generated by the multiple power electronic components, wherein at least one vapour chamber of the multiple vapour chambers is arranged to transfer heat to another vapour chamber of the multiple vapour chambers;
- wherein the at least one of the multiple vapour chambers is arranged in the power electronic module and at least one other of the multiple vapour chambers is arranged in the cooling element;
- wherein the power electronic module comprises a substrate having an upper surface and a lower surface, wherein the multiple power electronic components are attached to the upper surface, and wherein at least one of the multiple vapour chambers is attached to the lower surface of the substrate.
A power electronic assembly comprising:
- a power electronic module having multiple power electronic components and a cooling element, wherein the cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple vapour chambers arranged to transfer heat generated by the multiple power electronic components, wherein at least one vapour chamber of the multiple vapour chambers is arranged to transfer heat to another vapour chamber of the multiple vapour chambers;
- wherein at least two vapour chambers of the multiple vapour chambers are arranged in the power electronic module;
- wherein the power electronic module comprises at least two substrates to which the power electronic components are attached,
- wherein for each substrate, one of the at least two vapour chambers is arranged to receive heat from the substrate, and
- wherein at least one of the multiple vapour chambers is arranged to receive heat from the at least two vapour chambers.
2 more elements
Dependencies are inferred from the claim text.