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US 11,693,308 B2Granted
Molding apparatus that molds composition on substrate by using mold, molding method, and manufacturing method of article
AssigneeCanon Kabushiki Kaisha
InventorKeiji Yamashita
Life of this patent
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Abstract
A molding apparatus for molding a composition on a substrate using a mold includes a moving unit configured to hold and move the substrate and a gaseous matter supplying unit configured to supply gaseous matter. The gaseous matter supplying unit includes a supply port arranged in a periphery of the substrate held by the moving unit, and supplies the gaseous matter from the supply port while the moving unit is moving the substrate after the composite is supplied to the molding area in the periphery of the substrate.
Claims16
A molding apparatus for molding a composition on a substrate by using a mold, comprising:
- a mold holding unit configured to hold the mold;
- a moving unit configured to hold and move the substrate;
- a first supply port configured to supply gaseous matter between the substrate and the mold from a direction above the substrate;
- a second supply port configured to directly supply the gaseous matter to a space surrounded by a plurality of faces including the side face of the substrate and the upper face of the moving unit;
- and
- a control unit configured to control the supply of the gaseous matter from the first supply port and the second supply port,
- wherein the first supply port is arranged in a periphery of the mold holding unit,
- wherein the second supply port is arranged, across the space, in a position opposing to the side face of the substrate, or in the lower side of the space, and
- wherein, when the moving unit holds and moves the substrate of which a molding area is supplied with the composition, the control unit controls the supply of the gaseous matter to be supplied from both of the first supply port and the second supply port.
6 more elements
Dependencies are inferred from the claim text.