Back to results
US 11,444,058 B2Granted
Package structure with separated street between chips
AssigneeNovatek Microelectronics Corp.
InventorsChien-Chen Ko, Teng-Jui Yu, Wei-Kang Tsai
Life of this patent
Estimating the term…
Abstract
A package structure includes a first chip and a second chip. The first chip is connected to a pair of first signal lines and a plurality of first power lines. The second chip is connected to a pair of second signal lines and a plurality of second power lines. The first chip and the second chip belong to a common wafer. A separated street is between the first chip and the second chip.
Claims17
A package structure, comprising:
- a first chip connected to a pair of first signal lines and a plurality of first power lines;
- and
- a second chip connected to a pair of second signal lines and a plurality of second power lines,
- wherein the first chip and the second chip belong to a common wafer, and a separated street is between the first chip and the second chip,
- wherein the pair of first signal lines and the plurality of first power lines, the pair of second signal lines and the plurality of second power lines are disposed between a plurality of first pass lines and a plurality of second pass lines.
2 more elements
Dependencies are inferred from the claim text.