Cooling system for rack mounted electronic components

A system to improve cooling of rack mounted components, comprising:

• a first rack mounted component including a first motherboard, the first motherboard having a substantially rectangular shape;
• and
• a second rack mounted component disposed above the first rack mounted component;
• the second rack mounted component having a second motherboard having a substantially rectangular shape, wherein the second motherboard is similar to the first motherboard;
• wherein the second motherboard is disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that edges of the substantially rectangular first motherboard are non-aligned with edges of the substantially rectangular second motherboard;
• and
• wherein the first motherboard is arranged horizontally in a first plane and the second mother board is arranged horizontally in a second plane that is parallel to the first plane.

A system to improve cooling of rack mounted components, comprising:

• a first rack mounted component including a first motherboard, the first motherboard having a first edge;
• and
• a second rack mounted component disposed above the first rack mounted component;
• the second rack mounted component having a second motherboard having a first edge, wherein the second motherboard is similar to the first motherboard;
• wherein the second motherboard is disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that the first edge of the second motherboard is non-aligned with the first edge of the first motherboard;
• and
• wherein a relative orientation of the second motherboard with respect to the first motherboard creates a rotating airflow pattern as cooling air rises from the first motherboard to the second motherboard.