Target supply device, target supply method, and electronic device manufacturing method

A target supply method with an extreme ultraviolet light generation apparatus using a target supply device, the method comprising causing, by a moving body, an opening of a first recessed portion to be overlapped with a first connection port, then to be overlapped with a second connection port, and then to be overlapped with a third connection port,

• the target supply device including:
• a first container configured to contain a solid target substance;
• a second container including the first connection port connected to the first container, the second connection port connected to a first pressurized gas supply line, and the third connection port connected to a target substance lead-out path;
• the moving body including the first recessed portion configured to contain the solid target substance supplied from the first container and move the first recessed portion inside the second container;
• a third container connected to both a second pressurized gas supply line and the target substance lead-out path and configured to melt the solid target substance supplied from the third connection port;
• and
• a nozzle configured to output the melted target substance supplied from the third container.

An electronic device manufacturing method, comprising:

• generating extreme ultraviolet light by irradiating a target substance with pulsed laser light in an extreme ultraviolet light generation apparatus;
• emitting the extreme ultraviolet light to an exposure apparatus;
• and
• exposing a photosensitive substrate to the extreme ultraviolet light in the exposure apparatus to manufacture an electronic device,
• the extreme ultraviolet light generation apparatus including:
• a target supply device;
• and
• a laser light concentrating mirror configured to concentrate pulsed laser light on the target substance output to a predetermined region from the target supply device,
• the target supply device including:
• a first container configured to contain a solid target substance;
• a second container including a first connection port connected to the first container, a second connection port connected to a first pressurized gas supply line, and a third connection port connected to a target substance lead-out path;
• a moving body including a first recessed portion configured to contain the solid target substance supplied from the first container and move the first recessed portion inside the second container;
• a third container connected to both a second pressurized gas supply line and the target substance lead-out path and configured to melt the solid target substance supplied from the third connection port;
• and
• a nozzle configured to output the melted target substance supplied from the third container.