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US 11,309,207 B2Granted
Grounding mechanism for multi-layer for electrostatic chuck, and related methods
AssigneeEntegris, Inc.
InventorsSteven Donnell, Jakub Rybczynski, Chun Wang Chan, Yan Liu
Life of this patent
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Abstract
Described are multi-layer electrostatic chucks used to secure and support a wafer substrate during wafer processing, and related methods, wherein the chuck includes a grounding structure that includes a grounding layer and a grounding pin.
Claims11
A multi-layer electrostatic chuck assembly comprising:
- a dielectric layer;
- a conductive field coating above the dielectric layer;
- an electrode layer below the dielectric layer;
- an insulator layer below the electrode layer;
- a polymeric bonding layer below the dielectric layer and above the insulator layer;
- a grounding layer above the polymeric bonding layer, below the dielectric layer, and electrically connected to the conductive field coating;
- a grounding pin opening extending from a location of the insulator, through the polymeric bonding layer to the grounding layer;
- and
- a grounding pin located in the grounding pin opening, the grounding pin being electrically connected to the grounding layer.
6 more elements
A method comprising:
- forming a grounding pin opening in a multi-layer structure including a dielectric layer, an electrode layer disposed below the dielectric layer, an insulator layer below the electrode layer, a polymeric bonding layer disposed below the dielectric layer and the electrode layer and above the insulator layer, and a grounding layer disposed above the polymeric bonding layer, below the dielectric layer, and electrically connected to the field coating, the grounding pin opening extending from a location of the insulator layer, through the polymeric bonding layer and to the grounding layer;
- and
- inserting a grounding pin into the grounding pin opening and electrically connecting the grounding pin to the grounding layer.
Dependencies are inferred from the claim text.