On-chip signal path with electrical and physical connection

A microelectromechanical (MEMS) device, comprising:

• a plurality of layers, wherein at least one of the plurality of layers comprises one or more MEMS components;
• a first plurality of electrical connection points located at a first planar external surface of a first layer of the plurality of layers;
• a second plurality of electrical connection points located at a second planar external surface of a second layer of the plurality of layers;
• and
• a plurality of conductive paths over the first planar external surface and the second planar external surface, wherein each conductive path provides a continuous portion of material between one of the first plurality of electrical connection points and one of the second plurality of connection points, wherein each of the plurality of conductive paths extends along a third planar external planar surface of one or more of the plurality of layers that is located between the first planar external surface and the second planar external surface, wherein a non-conductive layer is disposed between each of the plurality of conductive paths and the plurality of layers, and wherein the non-conductive layer comprises a photoresist layer.

A method for operating a microelectromechanical (MEMS) device in an end-use device, comprising:

• receiving, at a first subset of a first plurality of electrical connection points, a plurality of signals from the MEMS device, wherein the MEMS device comprises a plurality of layers, wherein at least one of the plurality of layers comprises one or more MEMS components, and wherein the first plurality of electrical connection points are located at a first planar external surface of a first layer of the plurality of layers;
• providing, via a first subset of a plurality of conductive paths, the plurality of signals from the MEMS device to a first subset of a second plurality of electrical connection points, wherein each conductive path provides a continuous portion of material between one of the first plurality of electrical connection points and one of the second plurality of connection points, wherein a non-conductive layer is disposed between each of the first subset of the plurality of conductive paths and the plurality of layers, and wherein the non-conductive layer comprises a photoresist layer;
• receiving, at a second subset of the second plurality of electrical connection points, a plurality of signals from the end-use device, wherein the second plurality of electrical connection points are located at a second planar external surface of a second layer of the plurality of layers;
• and
• providing, via a second subset of the plurality of conductive paths, the plurality of electrical signals from the end-use device to a second subset of the first plurality of electrical connection points, wherein, for each of the conductive paths, the continuous portion of material includes a right angle between a respective first electrical connection point and a respective second electrical connection point, wherein a non-conductive layer is disposed between each of the second subset of the plurality of conductive paths and the plurality of layers, and wherein the non-conductive layer comprises a photoresist-layer.