Heat dissipation structure for electronic device and electronic device

A device, comprising:

• a rear cover, wherein a heat dissipating layer is disposed on the rear cover;
• a middle frame;
• a first printed circuit board (PCB), wherein a first shield cover is disposed on a first surface of the first PCB, and a second shield cover is disposed on a second surface of the first PCB;
• a battery;
• and
• a speaker box;
• wherein the first PCB, the battery, and the speaker box are disposed between the rear cover and the middle frame, the first PCB is separated from the speaker box by the battery;
• wherein a first region of the heat dissipating layer corresponds to the first shield cover of the first PCB, the second shield cover of the first PCB is in contact with a first region of the middle frame;
• wherein a second region of the heat dissipating layer corresponds to the battery, and a surface of the battery that is distal to the heat dissipating layer is in contact with a second region of the middle frame;
• and
• wherein a third region of the heat dissipating layer corresponds to the speaker box.