Devices, systems and methods for electrostatic force enhanced semiconductor bonding
AssigneeMicron Technology, Inc.
InventorsShu Qin, Ming Zhang
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Abstract
Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for enhancing wafer bonding includes positioning a substrate assembly on a unipolar electrostatic chuck in direct contact with an electrode, electrically coupling a conductor to a second substrate positioned on top of the first substrate, and applying a voltage to the electrode, thereby creating a potential differential between the first substrate and the second substrate that generates an electrostatic force between the first and second substrates.
Claims8
A system for enhancing bonding between a first substrate and a second substrate, the first substrate having a central portion and a perimeter portion, the system comprising:
- a unipolar electrostatic chuck configured to receive the first substrate, the chuck including a dielectric base and an electrode at least partially within the dielectric base, wherein a top surface of the electrode is configured to directly electrically contact the central portion and the perimeter portion of the first substrate;
- a conductor configured to be electrically coupled to the second substrate;
- and
- a power supply electrically coupled to the electrode and conductor, respectively, to apply an electrical bias between the electrode and conductor.
Dependencies are inferred from the claim text.