Semiconductor module having improved stud bolt configurations

A semiconductor module, comprising:

• a bottom part configured to constitute a bottom surface of a case accommodating a semiconductor device, the bottom part having an upper face on which the semiconductor device is mounted;
• an inner electrode including an electrode plate portion provided above the bottom part, and a connecting portion configured to electrically connect the electrode plate portion and the semiconductor device, the electrode plate portion being provided with a first through hole penetrating the electrode plate portion in a thickness direction thereof;
• a case frame including an annular frame part and a plate-like protrusion protruding in the form of a plate from an inner wall of the frame part, the frame part having a lower end portion connected to a peripheral portion of the bottom part, the plate-like protrusion overlapping the electrode plate portion, the plate-like protrusion being provided with a second through hole communicating with the first through hole;
• a stud bolt including, at one end thereof, a threaded part having a first series of threads, and including, at the other end thereof, a head part having a tapered shape with a larger diameter than that of the threaded part, the head part being provided with a threaded hole having a second series of threads in an inner wall thereof, the threaded part being screwed in the first through hole;
• and
• a case lid including a flat plate part mounted to an upper end portion of the frame part and provided with a third through hole directly above the head part, and a tubular part protruding downward from a periphery of the third through hole in the flat plate part to surround sides of the head part and having an inner diameter that increases downward,
• an adhesive being provided in a gap between the head part and the tubular part.