Heat sink assemblies for transient cooling
AssigneeGE Aviation Systems LLC
InventorsMichel Engelhardt, Paul Otto Stehlik, Judd Everett Swanson
Life of this patent
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Abstract
A heat sink assembly for use with at least one heat-emitting component where the heat sink assembly includes a first phase change material conductively coupled to the at least one heat-emitting component and changing phase at a first temperature and a second phase change material conductively coupled to the first phase change material and changing phase at a second temperature, which is greater than the first temperature.
Claims13
A heat sink assembly for use with at least one heat-emitting component, comprising:
- a first frame holding a first phase change material that changes phase at a first temperature where the first frame has at least a portion conductively coupled to the at least one heat-emitting component;
- a second frame holding a second phase change material that changes phase at a second temperature, which is greater than the first temperature;
- and
- a conductive element defining a structural barrier between the first phase change material and the second phase change material and conductively coupling the first phase change material and the second phase change material;
- wherein at least one of the first phase change material or the second phase change material includes an additive material for high radiation heat transfer emissivity and the first phase change material changes phase in response to a conductive transfer of heat from the heat-emitting component and the second phase change material changes phase in response to a conductive transfer of heat from the first phase change material.
A heat sink assembly for use with at least one heat-emitting component, comprising:
- a first frame holding a first phase change material that changes phase at a first temperature where the first frame has at least a portion conductively coupled to the at least one heat-emitting component;
- a second frame holding a second phase change material that changes phase at a second temperature, which is greater than the first temperature;
- and
- a conductive element defining a structural barrier between the first phase change material and the second phase change material and conductively coupling the first phase change material and the second phase change material;
- wherein the first frame and the second frame are configured as honeycombs and the first phase change material changes phase in response to a conductive transfer of heat from the heat-emitting component and the second phase change material changes phase in response to a conductive transfer of heat from the first phase change material.
Dependencies are inferred from the claim text.