Surface mount type device and manufacturing method for the same
AssigneeNihon Dempa Kogyo Co., Ltd.
InventorMasato Ogawa
Life of this patent
Estimating the term…
Abstract
A surface mount type device includes: an electronic component, a main substrate on which the electronic component is mounted, a pedestal on which the main substrate is mounted, a lower substrate on which the pedestal is mounted, and a cover mounted on the lower substrate so as to cover the pedestal. The soldering pattern is soldered with the cover from a region where the cover is mounted to an inside of the lower substrate, on the lower substrate. The pedestal includes a cut-out portion in a side surface portion so as to form a space above the soldering pattern. The cover is secured to the soldering pattern by a solder formed in the space.
Claims4
A surface mount type device, comprising:
- an electronic component;
- a main substrate on which the electronic component is mounted;
- a pedestal on which the main substrate is mounted, wherein the pedestal has an outer frame portion and a beam portion which connects two long sides of the outer frame portion;
- a lower substrate on which the pedestal is mounted;
- a cover mounted on the lower substrate so as to cover the pedestal, wherein
- a soldering pattern soldered with the cover from a region where the cover is mounted to an inside of the lower substrate, on the lower substrate;
- and
- the pedestal includes a cut-out portion disposed in a side surface portion of the outer frame portion so as to form a space above the soldering pattern, the cut-out portion is configured not to penetrate the side surface portion of the outer frame portion, and the soldering pattern extends from a region outside of the pedestal to the space formed by the cut-out portion, and
- the cover is secured to the soldering pattern by a solder formed in the space.
Dependencies are inferred from the claim text.