Thermal conduction structrure and manufacturing method thereof

A thermal conduction structure, comprising:

• a vapor chamber, including an upper casing, a lower casing sealed and engaged with the upper casing, and a cavity formed between the lower casing and the upper casing, and the upper casing having at least one through hole communicated with the cavity, and a first capillary tissue being disposed on the internal surface of the upper casing, and the first capillary tissue being a braided metal mesh having at least one penetrating hole formed thereon and configured to be corresponsive to the at least one through hole, and a plurality of dividing lines formed around an outer periphery of the at least one penetrating hole;
• at least one heat pipe, including a tube and a second capillary tissue, the tube having an open end and a closed end, and the second capillary tissue being coated on an inner surface of the tube without filling the tube, and further extended out from the tube to define an exposed section;
• after the at least one heat pipe being passed through and coupled to the at least one through hole, the exposed section being passed through the at least one penetrating hole to force the first capillary tissue around the periphery of the at least one penetrating hole to bend and deform to be against the exposed section;
• and
• a working fluid, filled in the cavity;
• wherein an inner surface of the lower casing has a third capillary tissue disposed thereon, the exposed section is inserted into the cavity without contacting the third capillary tissue;
• and
• wherein a bottom surface of the tube at the open end is coplanar with an inner side of a top surface of the upper casing, so the tube is not inserted inside the vapor chamber.