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US 10,372,036 B2Granted
Mold, method of producing mold, production apparratus, and method of manufacturing semiconductor device
AssigneesKabushiki Kaisha Toshiba, The University of Tokyo
InventorsYongfang Li, Hiroyuki Fujita
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Abstract
A edge electrode mold according to an embodiment includes a base having a first main surface and one or more protruding structures disposed on the first main surface. The protruding structures include a protrusion projecting from the first main surface of the base, an edge electrode disposed at the protrusion, and an electrolytic hydrophobic film having electrolytic property and hydrophobicity disposed on the upper end surface of a protruding shape including the protrusion and the edge electrode.
Claims13
A mold comprising:
- a base having s first main surface;
- and
- one or more protruding structure disposed on the first main surface,
- the protruding structures comprising;
- a protrusion projecting from the first main surface of the base,
- a first electrode disposed at the protrusion, and
- an electrolytic hydrophobic film disposed on an upper surface of a protruding shape including the protrusion and the first electrode, the electrolytic hydrophobic film having electrolytic property and hydrophobicity.
4 more elements
Dependencies are inferred from the claim text.