Thermal interface material structures including protruding surface features to reduce thermal interface material migration

A process of forming a thermal interface material structure, the process comprising:

• forming an assembly that includes a thermal interface material disposed between a module lid mating surface associated with a lid that surrounds an electronic component and a heat sink mating surface associated with a heat sink, wherein protruding surface features are incorporated onto the heat sink mating surface, and
• compressing the assembly to form a thermal interface material structure, the thermal interface material structure including the thermal interface material disposed within an interface defined by the module lid mating surface and the heat sink mating surface,
• wherein the protruding surface features protrude away from the heat sink mating surface into selected areas of the interface to limit relative movement of the module lid mating surface and the heat sink mating surface into the selected areas during thermal cycling to reduce thermal interface material migration out of the interface,
• wherein the protruding surface features physically contact the module lid mating surface before thermal cycling, and
• wherein at least one of the protruding surface features bows away from and does not make contact with the module lid mating surface after thermal cycling.