Power semiconductor device comprising a substrate and load current terminal elements

A power semiconductor device system, comprising:

• at least a first and a second power semiconductor device;
• each said power semiconductor device, further comprising:
• a substrate having at least one cooling device;
• at least one power semiconductor component arranged on the substrate and electrically and conductively connected to the substrate;
• a plurality of electrically conductive load current terminal element, on said substrate, said load current terminal elements further comprising:
• at least one pressure device, each said pressure device further comprising:
• at least one pressure element, arranged movably in a direction that is normal (N) to the substrate;
• at least one elastic deformation element, arranged between the pressure element and said at least one assigned load current terminal element;
• the at least one pressure element pressing the at least one load current terminal element against an electrically conductive contact area of the substrate through the elastic deformation element and thereby providing an electrically conductive pressure contact between the at least one load current terminal element and said substrate;
• and
• wherein the second power semiconductor device is arranged on the first power semiconductor device;
• and
• an outer side of the cooling device of the second power semiconductor device faces the at least one pressure element of the first power semiconductor device and presses against the pressure element of the first power semiconductor device in the direction of the substrate of the first power semiconductor device.

A power semiconductor device, comprising:

• a substrate having at least one cooling device;
• at least one power semiconductor component arranged on the substrate and electrically and conductively connected to the substrate;
• a plurality of electrically conductive load current terminal element, on said substrate, said load current terminal elements further comprising:
• at least one pressure device, each said pressure device further comprising:
• at least one pressure element, arranged movably in a direction that is normal (N) to the substrate;
• at least one elastic deformation element, arranged between the pressure element and said at least one assigned load current terminal element;
• and
• the at least one pressure element pressing the at least one load current terminal element against an electrically conductive contact area of the substrate through the elastic deformation element and thereby providing an electrically conductive pressure contact between the at least one load current terminal element and said substrate;
• and
• a pressure element receptacle device, comprising:
• a first receptacle device for receiving said at least one pressure element, wherein at least one section of a respective said pressure element is arranged in the respective first receptacle device;
• wherein:
• the at least one pressure device, further comprises:
• an intermediate element between the elastic deformation element and the assigned load current terminal element;
• and
• the pressure element urging the assigned load current terminal element against said electrically conductive contact area of the substrate through the elastic deformation element and the intermediate element.

A power semiconductor device, comprising:

• a substrate having at least one cooling device;
• at least one power semiconductor component arranged on the substrate and electrically and conductively connected to the substrate;
• a plurality of electrically conductive load current terminal element, on said substrate, said load current terminal elements further comprising:
• at least one pressure device, each said pressure device further comprising:
• at least one pressure element, arranged movably in a direction that is normal (N) to the substrate;
• at least one elastic deformation element, arranged between the pressure element and said at least one assigned load current terminal element;
• and
• the at least one pressure element pressing the at least one load current terminal element against an electrically conductive contact area of the substrate through the elastic deformation element and thereby providing an electrically conductive pressure contact between the at least one load current terminal element and said substrate;
• and
• a pressure element receptacle device, comprising:
• a first receptacle device for receiving said at least one pressure element, wherein at least one section of a respective said pressure element is arranged in the respective first receptacle device;
• wherein:
• the at least one pressure element respectively has a pressure main element and at least a first and a second pin projecting from the pressure main element in a direction normal (N) away from the substrate;
• a side surface of the pressure main element facing away from the pin presses onto the elastic deformation element in the direction of the normal (N) to the substrate;
• and
• in a portion of said at last one pressure device of said pressure element, at said at least first pin has a first pin-height and said second pin has a second pin-height that is different from said first pin-height.