Method and system for intelligent weak pattern diagnosis, and non-transitory computer-readable storage medium

An intelligent weak pattern diagnosis system for diagnosing the intelligent weak pattern being implemented by a computer, comprising:

• creating at least one basic matching element over an object under test;
• introducing, by a processor, a weak pattern layout from a defect pattern library and a frequent failure defect pattern library;
• acquiring, by the processor, the defect inspection data by a defect inspection tool in a process plant;
• introducing, by the processor, design layout data which includes systematic defect and weak patterns;
• executing, by the processor, weak pattern screen and filter to acquire a known weak pattern group by comparing the weak patterns from the libraries and the design layout, in which the design layout data is compared with weak patterns recorded in the defect pattern library and the frequent failure defect pattern library, so as to acquire a known weak pattern group;
• performing, by the processor, unknown weak pattern screen and filter, in which pattern similarity matching is performed on the design layout data acquired by the computer, so as to find out weak patterns, which do not belong to and are not similar with the patterns in the defect pattern library or the frequent failure defect pattern library, categorized into a unknown weak pattern group;
• acquiring, by the processor, distribution of the known weak pattern group and the unknown weak pattern group;
• acquiring, by the processor, an image of object under test, including coordinates and metrology data of the weak patterns of the object under test;
• converting the defect or weak patterns found on the coordinate system of design layout with an origin (x0, y0) to the coordinate system with the origin (x1, y1) of the defect inspection tool that scans the real semiconductor product;
• performing, by the processor, image processing, for acquiring contour of the weak patterns, dimension, range and number of the weak patterns to update the weak pattern library;
• and
• detecting, by the processor, a defect on the real semiconductor product using by contour matching using the weak pattern layout in the updated weak pattern library.

An instruction set for diagnosing an intelligent weak pattern stored in a non-transitory computer-readable storage medium, wherein the instruction set comprises:

• creating at least one basic matching element over an object under test;
• introducing, by a processor, weak pattern layout from a defect pattern library and a frequent failure defect pattern library;
• acquiring, by the processor, defect inspection data by a defect inspection tool in a process plant;
• introducing, by the processor, the design layout data, including various systematic defect and weak patterns;
• executing, by the processor, weak pattern screen and filter to acquire a known weak pattern group by comparing the weak patterns from the libraries and the design layout, for comparing the design layout data with the weak patterns recorded in the defect pattern library and the frequent failure defect pattern library, so as to acquire a unknown weak pattern group;
• performing, by the processor, unknown weak pattern screen and filter, including performing pattern similarity matching on the design layout data for finding out the weak patterns, which do not belong to and are not similar with the patterns recorded in the defect pattern library or the frequent failure defect pattern library, so as to acquire a unknown weak pattern group;
• acquiring, by the processor, distribution of the known weak pattern group and the unknown weak pattern group;
• acquiring, by the processor, an image of object under test, including coordinates and metrology data of the weak patterns of the object under test;
• converting the defect or weak patterns found on the coordinate system of design layout with an origin (x0, y0) to the coordinate system with the origin (x1, y1) of the defect inspection tool that scans the real semiconductor product;
• performing, by the processor, image processing, for acquiring contour of the weak patterns, dimension, range and number of the weak patterns, so as to judge systematic weak patterns;
• updating, by the processor, the weak pattern library;
• and
• detecting, by the processor, a defect on the real semiconductor product using by contour matching using the weak pattern layout in the updated weak pattern library.