Methods and apparatus for rapidly cooling a substrate

A method for changing the temperature of a substrate, comprising:

• placing a substrate onto a support surface of a substrate support disposed within a first volume of an inner volume of a chamber;
• moving at least one of the substrate support or a plate disposed in the chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate by forming a seal between the substrate support and the plate in a location disposed radially outward of the substrate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume;
• flowing a gas into the second volume to increase a pressure within the second volume;
• and
• flowing a heat transfer fluid through a plurality of channels disposed in at least one of the substrate support or the plate to change the temperature of the substrate.

A method for changing the temperature of a substrate, comprising:

• placing a substrate onto a support surface of a substrate support disposed within a first volume of an inner volume of a chamber;
• moving at least one of the substrate support or a plate disposed in the chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate by forming a seal between the substrate support and the plate in a location disposed radially outward of the substrate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume;
• increasing a pressure within the second volume;
• and
• flowing a heat transfer fluid through a plurality of channels disposed in at least one of the substrate support or the plate to change the temperature of the substrate.