Substrate processing method and substrate processing apparatus

A substrate processing method comprising:

• an information receiving step of receiving a width and a height of a pattern formed on a front surface of a substrate;
• a maximum height searching step of searching for a maximum height, that corresponds to the received width of the pattern formed on the front surface of the substrate to be processed, among a plurality of maximum heights each being a maximum value of a height of a pattern having a particular width when pattern collapse does not occur;
• a height comparing step of determining whether or not the received height of the pattern formed on the front surface of the substrate is greater than the maximum height found in the maximum height searching step;
• a hydrophobizing step of supplying, in a case where the height of the pattern is greater than the maximum height, a hydrophobizing agent to the substrate such that a hydrophobized region is formed on a whole tip-side region that is a region other than a root-side region from a root of the pattern to the maximum height in a lateral surface of the pattern, and a non-hydrophobized region remains on at least a portion of the root-side region in the lateral surface of the pattern;
• a pre-drying rinsing step of replacing the hydrophobizing agent held by the substrate with a solvent lower in surface tension than water by supplying the solvent to the substrate, after the hydrophobizing step;
• and
• a drying step of drying the substrate by removing the solvent held by the substrate, after the pre-drying rinsing step.