Polishing head, CMP apparatus having polishing head, and semiconductor integrated circuit manufacturing method using CMP apparatus

A polishing head of a CMP apparatus, comprising:

• a polishing pad;
• a first air bag and a second air bag, which are in contact with a rear surface of a wafer mounted on a front surface of the polishing pad, and which are configured to press a front surface of the wafer against the polishing pad;
• and
• a top ring surrounding the first air bag, the second air bag, and the wafer,
• the first air bag, which is in contact with a central portion of the wafer, and the second air bag, which is in contact with a peripheral portion of the wafer, being separate bag bodies, and
• the first air bag, which is in contact with the central portion of the wafer, has a first film thickness, and the second air bag, which is in contact with the peripheral portion of the wafer, has a second film thickness that is thicker than the first film thickness.