Y10T 83/538
Positioning of tool controlled
Y10T83/538 (Positioning of tool controlled) appears on 249 US grants and 95 published applications in this corpus.
Search patents in Y10T- Granted patents
- 249
- Published applications
- 95
- Assignees
- 173
- Inventors
- 389
- Latest grant
- 20 Sep 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 7 | 0 |
| 1978 | 9 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 11 | 0 |
| 1986 | 7 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 8 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 9 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 9 | 0 |
| 1999 | 4 | 0 |
| 2000 | 10 | 0 |
| 2001 | 10 | 5 |
| 2002 | 5 | 4 |
| 2003 | 17 | 17 |
| 2004 | 5 | 11 |
| 2005 | 12 | 7 |
| 2006 | 11 | 10 |
| 2007 | 3 | 1 |
| 2008 | 1 | 7 |
| 2009 | 5 | 2 |
| 2010 | 10 | 3 |
| 2011 | 5 | 4 |
| 2012 | 5 | 7 |
| 2013 | 1 | 5 |
| 2014 | 5 | 4 |
| 2015 | 3 | 5 |
| 2016 | 2 | 1 |
| 2017 | 4 | 1 |
| 2018 | 1 | 1 |
| 2019 | 0 | 0 |
| 2020 | 2 | 0 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces20 Sep 2022US 11,450,577 B2Micron Technology, Inc.
- Method for cutting belt-like member, and apparatus therefor7 Dec 2021US 11,192,319 B2The Yokohama Rubber Co., Ltd.
- Automatically configurable blind cutting center6 Oct 2020US 10,792,739 B2Hunter Douglas Industries Switzerland GmbH
- Apparatus and method for rotary die X, Y, and theta registration21 Jul 2020US 10,717,203 B2Preco, Inc.
- Punching device, image forming apparatus, and punching method17 Jul 2018US 10,022,885 B2KYOCERA Document Solutions Inc.
- Apparatus and method for rotary die x, y, and theta registration3 May 2018US 2018/0117786 A1Preco, Inc.
- Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces25 May 2017US 2017/0148691 A1Micron Technology, Inc.
- Method for Cutting Belt-Like Member, and Apparatus Therefor13 Oct 2016US 2016/0297159 A1The Yokohama Rubber Co., Ltd.
- Industrial slicer26 Nov 2015US 2015/0336285 A1Grasselli S.P.A.
- Punching device, image forming apparatus, and punching method8 Oct 2015US 2015/0283722 A1KYOCERA Document Solutions Inc.
Most cited
By later US patents
- Method and apparatus for forming cuts in catheters, guidewires, and the like182US 6,014,919 APrecision Vascular Systems, Inc. · 2000
- Method and apparatus for forming cuts in catheters, guidewires and the like151US 6,766,720 B1Sarcos LC · 2004
- Method and apparatus for forming cuts in catheters, guide wires, and the like144US 6,260,458 B1Sarcos LC · 2001
- Micromachining system108US 6,553,880 B2Sarcos LC · 2003
- Method and apparatus for forming cuts in catheters, guide wires, and the like103US 6,431,039 B1Sarcos LC · 2002