Y10T 29/49792
Dividing through modified portion
Y10T29/49792 (Dividing through modified portion) appears on 161 US grants and 51 published applications in this corpus.
Search patents in Y10T- Granted patents
- 161
- Published applications
- 51
- Assignees
- 105
- Inventors
- 235
- Latest grant
- 7 May 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 5 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 10 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 0 | 0 |
| 2000 | 7 | 0 |
| 2001 | 8 | 4 |
| 2002 | 7 | 9 |
| 2003 | 7 | 4 |
| 2004 | 10 | 5 |
| 2005 | 5 | 2 |
| 2006 | 2 | 3 |
| 2007 | 0 | 2 |
| 2008 | 0 | 3 |
| 2009 | 5 | 1 |
| 2010 | 4 | 3 |
| 2011 | 5 | 4 |
| 2012 | 2 | 3 |
| 2013 | 1 | 0 |
| 2014 | 4 | 1 |
| 2015 | 1 | 2 |
| 2016 | 2 | 2 |
| 2017 | 0 | 0 |
| 2018 | 2 | 0 |
| 2019 | 1 | 2 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Process for making a connecting element for the friction-increasing connection of components, and use of a connecting element7 May 2024US 11,976,679 B23M Innovative Properties Company
- Efficient assembly of triple pane windows17 May 2022US 11,332,972 B2GED Integrated Solutions, Inc.
- Method for manufacturing a winding core29 Jun 2021US 11,050,329 B2Murata Manufacturing Co., Ltd.
- Efficient assembly of triple pane insulating glass units25 Jun 2019US 10,329,832 B2GED Integrated Solutions, Inc.
- Method of forming fracture start portion of connecting rod and forming device21 Aug 2018US 10,052,702 B2Yasunaga Corporation
- Process For Making A Connecting Element For The Friction-Increasing Connection Of Components, And Use Of A Connecting Element1 Feb 2024US 2024/0035499 A13M Innovative Properties Company
- Efficient assembly of triple pane windows26 Sep 2019US 2019/0292842 A1GED Integrated Solutions, Inc.
- Winding core, method for manufacturing the same, and winding core aggregate27 Jun 2019US 2019/0199182 A1Murata Manufacturing Co., Ltd.
- Efficient assembly of triple pane windows3 Nov 2016US 2016/0319589 A1GED Integrated Solutions, Inc.
- Method of forming fracture start portion of con rod and forming device17 Mar 2016US 2016/0074949 A1Yasunaga Corporation
Most cited
By later US patents
- Method of assembling stacks of integrated circuit dies179US 4,984,358 AMicroelectronics and Computer Technology Corporation · 1991
- Ultrasonic phased array transducer with an ultralow impedance backfill and a method for making177US 5,655,538 AGeneral Electric Company · 1997
- Method of dicing a semiconductor wafer70US 4,610,079 ATokyo Shibaura Denki Kabushiki Kaisha · 1986
- Ultrasonic phased array transducer with an ultralow impedance backfill and a method for making63US 5,852,860 AGeneral Electric Company · 1998
- Process for preparing integrated circuit dies for mounting58US 4,930,216 AMicroelectronics and Computer Technology Corporation · 1990