Y10T 29/49055
With bond/laminating preformed parts, at least two magnetic
Official title: with bond/laminating preformed parts, at least two magnetic
Y10T29/49055 (With bond/laminating preformed parts, at least two magnetic) appears on 282 US grants and 78 published applications in this corpus.
Search patents in Y10T- Granted patents
- 282
- Published applications
- 78
- Assignees
- 94
- Inventors
- 404
- Latest grant
- 29 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 4 | 0 |
| 1981 | 7 | 0 |
| 1982 | 6 | 0 |
| 1983 | 9 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 6 | 0 |
| 1987 | 9 | 0 |
| 1988 | 12 | 0 |
| 1989 | 20 | 0 |
| 1990 | 19 | 0 |
| 1991 | 16 | 0 |
| 1992 | 15 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 6 | 7 |
| 2002 | 6 | 10 |
| 2003 | 15 | 16 |
| 2004 | 10 | 9 |
| 2005 | 6 | 7 |
| 2006 | 12 | 4 |
| 2007 | 8 | 2 |
| 2008 | 5 | 4 |
| 2009 | 2 | 4 |
| 2010 | 2 | 1 |
| 2011 | 3 | 3 |
| 2012 | 4 | 0 |
| 2013 | 3 | 2 |
| 2014 | 0 | 2 |
| 2015 | 0 | 2 |
| 2016 | 1 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Method for producing lamination stacks and facility for performing the method29 Jul 2025US 12,374,969 B2Feintool International Holding AG
- Method for producing lamination stacks and facility for performing the method24 Aug 2021US 11,101,721 B2Kienle + Spiess GmbH
- Method for producing lamination stacks and facility for performing the method12 Mar 2019US 10,230,291 B2Kienle + Spiess GmbH
- Disk drive system24 Apr 2018US 9,953,667 B2Western Digital Technologies, Inc.
- Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads25 Apr 2017US 9,633,680 B2Western Digital Technologies, Inc.
- Method for Producing Lamination Stacks and Facility for Performing the Method23 Oct 2025US 2025/0330069 A1Feintool International Holding AG
- Method for Producing Lamination Stacks and Facility for Performing the Method16 Dec 2021US 2021/0391775 A1Kienle + Spiess GmbH
- Method for Producing Lamination Stacks and Facility for Performing the Method23 May 2019US 2019/0157950 A1Kienle + Spiess GmbH
- Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads1 Jun 2017US 2017/0154645 A1Western Digital Technologies, Inc.
- Method for Producing Lamination Stacks and Facility for Performing the Method19 May 2016US 2016/0141942 A1Kienle + Spiess GmbH
Most cited
By later US patents
- Low inductance, ferrite sub-gap substrate structure for surface film magnetic recording heads139US 6,496,328 B1Advanced Research Corporation · 2002
- Method for the manufacture of planar magnetic heads by making cavities in a non-magnetic wafer43US 5,067,230 AThomson-CSF · 1991
- Batch fabricated servo write head having low write-gap linewidth variation37US 6,018,444 AHewlett-Packard Company · 2000
- Method of producing a head core slider35US 5,020,213 AApplied Magnetics Corporation · 1991
- Method of making a patterned magnetic recording head35US 6,269,533 B1Advanced Research Corporation · 2001