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  1. Technology classes
  2. /Y · General tagging of new technological developments
  3. /Y10 · Technical subjects covered by former uspc
  4. /Y10S · Technical subjects covered by former uspc cross-reference art collections [xracs] and digests
  5. /Y10S 165/00 · Heat exchange
  6. /Y10S 165/454 · Heat exchange: having side-by-side conduits structure or conduit section
  7. /Y10S 165/50 · Side-by-side conduits with fins
  8. /Y10S 165/501 · Plate fins penetrated by plural conduits
  9. /Y10S 165/504
Y10S 165/504

Contoured fin surface

Y10S165/504 (Contoured fin surface) appears on 13 US grants and 3 published applications in this corpus.

Search patents in Y10S

Where it sits

  1. YGeneral tagging of new technological developments
  2. Y10Technical subjects covered by former uspc
  3. Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests
  4. Y10S 165/00Heat exchange
  5. Y10S 165/454Heat exchange: having side-by-side conduits structure or conduit section
  6. Y10S 165/50Side-by-side conduits with fins
  7. Y10S 165/501Plate fins penetrated by plural conduits
  8. Y10S 165/504Contoured fin surface
Granted patents
13
Published applications
3
Assignees
10
Inventors
25
Latest grant
28 Aug 2007

Filings by year

Granted patentsPublished applications
Y10S 165/504: granted patents and published applications per publication year
YearGranted patentsPublished applications
198310
198410
198500
198610
198700
198810
198900
199010
199120
199200
199300
199400
199500
199600
199710
199800
199920
200000
200100
200200
200300
200401
200502
200600
200730

198319932007

By publication year. Applications have been published since 2001.

Recent patents

  • Heat exchanger28 Aug 2007US 7,261,147 B2LG Electronics Inc.
  • Heat exchanger22 May 2007US 7,219,716 B2LG Electronics Inc.
  • Heat exchanger27 Feb 2007US 7,182,127 B2LG Electronics Inc.
  • Heat exchanger fin with enhanced corrugations27 Jul 1999US 5,927,393 AHeatcraft Inc.
  • Heat exchanger for air conditioner6 Apr 1999US 5,890,532 ASamsung Electronics Co., Ltd.
  • Heat exchanger17 Mar 2005US 2005/0056407 A1LG Electronics Inc.
  • Heat exchanger3 Mar 2005US 2005/0045316 A1LG Electronics Inc.
  • Heat exchanger16 Dec 2004US 2004/0251016 A1LG Electronics Inc.

Most cited

By later US patents
  • Heat exchanger rib35US 4,923,002 AThermal-Werke Warme-, Kalte-, Klimatechnik GmbH · 1990
  • Heat-exchanger utilizing pressure differential30US 5,009,263 AMitsubishi Denki K. K. · 1991
  • Heat exchanger fin element with dog-bone type pattern of corrugations21US 4,449,581 AChromalloy American Corporation · 1984
  • Heat exchanger fin with enhanced corrugations21US 5,927,393 AHeatcraft Inc. · 1999
  • Reinforced plate fin heat exchanger14US 4,592,420 AModine Manufacturing Company · 1986

Top assignees

Documents
  • LG Electronics Inc.7
  • Caterpillar Tractor Co.1
  • CAChromalloy American Corporation1
  • HHeatcraft Inc.1
  • MDMitsubishi Denki K. K.1
  • MMModine Manufacturing Company1
  • Samsung Electronics Co., Ltd.1
  • Sanden Corporation1
  • SBSulzer Brothers Limited1
  • TWThermal-Werke Warme-, Kalte-, Klimatechnik GmbH1

Often classified with

  • F28FDetails of heat-exchange and heat-transfer apparatus, of general application16
  • F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange4
  • F25DRefrigerators1
  • F28BSteam or vapour condensers1

Documents that also carry the other class.

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