H01R 4/026

Comprising means for eliminating an insulative layer prior to soldering or welding

Official title: {comprising means for eliminating an insulative layer prior to soldering or welding}

H01R4/026 (Comprising means for eliminating an insulative layer prior to soldering or welding) appears on 27 US grants and 20 published applications in this corpus.

Search patents in H01R
Granted patents
27
Published applications
20
Assignees
31
Inventors
74
Latest grant
11 Feb 2025

Filings by year

H01R 4/026: granted patents and published applications per publication year
YearGranted patentsPublished applications
197610
197720
197800
197900
198000
198100
198210
198310
198400
198500
198610
198700
198800
198900
199010
199120
199200
199310
199400
199500
199620
199700
199800
199910
200010
200100
200200
200300
200401
200500
200610
200702
200800
200900
201000
201101
201200
201300
201412
201510
201601
201701
201801
201911
202022
202102
202221
202323
202421
202510
202601

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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