H01M 8/0256

Vias, i.e. connectors passing through the separator material

H01M8/0256 (Vias, i.e. connectors passing through the separator material) appears on 157 US grants and 213 published applications in this corpus.

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Granted patents
157
Published applications
213
Assignees
122
Inventors
495
Latest grant
12 May 2026

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H01M 8/0256: granted patents and published applications per publication year
YearGranted patentsPublished applications
198010
198100
198200
198300
198400
198510
198600
198720
198800
198900
199000
199100
199200
199300
199400
199500
199600
199700
199820
199940
200020
200142
200246
2003313
2004211
2005817
2006616
2007319
2008811
200957
2010145
201189
201283
2013810
201436
201525
201668
201719
2018143
201957
202067
202155
202259
202325
2024611
202567
202632

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