H01K 3/20

Sealing-in wires directly into the envelope

H01K3/20 (Sealing-in wires directly into the envelope) appears on 29 US grants and 18 published applications in this corpus.

Search patents in H01K
Granted patents
29
Published applications
18
Assignees
18
Inventors
49
Latest grant
22 Sep 2020

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H01K 3/20: granted patents and published applications per publication year
YearGranted patentsPublished applications
197620
197700
197800
197910
198010
198100
198200
198300
198410
198500
198600
198700
198800
198900
199000
199120
199210
199310
199410
199500
199600
199700
199800
199920
200000
200100
200200
200301
200407
200521
200650
200722
200802
200900
201021
201100
201211
201301
201420
201510
201601
201710
201800
201901
202010

By publication year. Applications have been published since 2001.

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