H01J 2201/2871
Being flattened
Official title: being flattened
H01J2201/2871 (Being flattened) appears on 2 US grants and 2 published applications in this corpus.
Search patents in H01J- Granted patents
- 2
- Published applications
- 2
- Assignees
- 1
- Inventors
- 3
- Latest grant
- 31 Mar 2026
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| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 1 | 0 |
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