H01H 2229/024

Packing between substrate and membrane

H01H2229/024 (Packing between substrate and membrane) appears on 229 US grants and 111 published applications in this corpus.

Search patents in H01H
Granted patents
229
Published applications
111
Assignees
148
Inventors
404
Latest grant
7 Jan 2025

Filings by year

H01H 2229/024: granted patents and published applications per publication year
YearGranted patentsPublished applications
197630
197750
197860
197920
198050
1981110
1982130
198370
1984110
1985140
198670
198790
198860
198940
199060
199120
199220
199330
199440
199500
199630
199700
199840
199900
200000
200176
200289
200396
200430
200534
200666
200714
200811
2009512
201042
201158
201233
2013310
201469
201545
201665
201787
201854
201933
202014
202150
202221
202310
202422
202510

By publication year. Applications have been published since 2001.

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