H01H 2207/012

Via underside of substrate

Official title: via underside of substrate

H01H2207/012 (Via underside of substrate) appears on 47 US grants and 23 published applications in this corpus.

Search patents in H01H
Granted patents
47
Published applications
23
Assignees
39
Inventors
96
Latest grant
7 Apr 2026

Filings by year

H01H 2207/012: granted patents and published applications per publication year
YearGranted patentsPublished applications
197630
197730
197820
197910
198020
198100
198220
198300
198400
198520
198610
198710
198800
198920
199010
199100
199220
199300
199400
199520
199610
199700
199810
199910
200000
200111
200211
200302
200401
200510
200611
200700
200804
200922
201023
201130
201210
201311
201400
201510
201601
201710
201810
201901
202010
202111
202201
202301
202412
202500
202610

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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