H01H 2011/065

By plating metal or conductive rubber on insulating substrate

Official title: {by plating metal or conductive rubber on insulating substrate, e.g. Molded Interconnect Devices [MID]}

H01H2011/065 (By plating metal or conductive rubber on insulating substrate) appears on 17 US grants and 10 published applications in this corpus.

Search patents in H01H
Granted patents
17
Published applications
10
Assignees
14
Inventors
42
Latest grant
2 Jun 2020

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H01H 2011/065: granted patents and published applications per publication year
YearGranted patentsPublished applications
199310
199410
199500
199600
199700
199820
199910
200010
200120
200211
200301
200410
200500
200600
200700
200800
200900
201001
201110
201200
201300
201401
201510
201602
201702
201811
201930
202010
202101

By publication year. Applications have been published since 2001.

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