H01H 1/0231
Provided with a solder layer
Official title: {provided with a solder layer}
H01H1/0231 (Provided with a solder layer) appears on 26 US grants and 11 published applications in this corpus.
Search patents in H01H- Granted patents
- 26
- Published applications
- 11
- Assignees
- 19
- Inventors
- 56
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 1 |
| 2025 | 0 | 3 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Contact for a vacuum interrupter and production method for such a contact19 May 2026US 12,633,469 B2Siemens Aktiengesellschaft
- Tape-shaped contact member and method for manufacturing same10 May 2022US 11,329,405 B2Tanaka Kikinzoku Kogyo K.K.
- Corrosion resistant barrier formed by vapor phase tin reflow29 Dec 2015US 9,224,550 B2Tyco Electronics Corporation
- Sliding contact material comprising Ag-Ni based alloy having Ni metal particles dispersed and clad composite material, and Dc compact motor using the same28 Oct 2003US 6,638,334 B2Mabuchi Motor Co., Ltd.
- Electric circuit protection device having electrical parts ultrasonically joined using a brazing alloy11 Apr 2000US 6,049,046 ASiemens Energy & Automation, Inc.
- Process for Joining Silver-Graphite to Copper Carriers3 Jul 2025US 2025/0214164 A1ABB Schweiz AG
- Contact carrier, contact-carrier arrangement and low-voltage protective switching device27 Mar 2025US 2025/0104936 A1Siemens Aktiengesellschaft
- Brazing Method, Brazed Joint, and Braze16 Jan 2025US 2025/0018489 A1ABB Schweiz AG
- Method of Forming a Contact Piece for a Circuit Breaker5 Dec 2024US 2024/0399619 A1ABB Schweiz AG
- Contact for a vacuum interrupter and production method for such a contact16 Nov 2023US 2023/0368986 A1Siemens Aktiengesellschaft
Most cited
By later US patents
- Method of brazing Cu alloys to Ag-Cdo alloys15US 3,941,299 AEngelhard Minerals & Chemicals Corporation · 1976
- Electrical contact and process for making the same12US 4,622,269 AGTE Products Corporation · 1986
- Ag-SnO Alloy composite electrical contact11US 4,246,321 AChugai Denki Kogya Kabushiki-Kaisha · 1981
- Electrical contact element and method of producing the same9US 4,019,876 AG. Rau GmbH & Co. · 1977
- Electrical contact piece8US 4,456,662 ADegussa AG · 1984