H01F 1/28
Dispersed or suspended in a bonding agent
Official title: dispersed or suspended in a bonding agent
H01F1/28 (Dispersed or suspended in a bonding agent) appears on 146 US grants and 214 published applications in this corpus.
Search patents in H01F- Granted patents
- 146
- Published applications
- 214
- Assignees
- 123
- Inventors
- 470
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 2 | 2 |
| 2003 | 4 | 5 |
| 2004 | 1 | 4 |
| 2005 | 3 | 3 |
| 2006 | 1 | 1 |
| 2007 | 1 | 3 |
| 2008 | 1 | 5 |
| 2009 | 3 | 3 |
| 2010 | 0 | 6 |
| 2011 | 4 | 5 |
| 2012 | 1 | 10 |
| 2013 | 6 | 8 |
| 2014 | 1 | 6 |
| 2015 | 4 | 10 |
| 2016 | 3 | 6 |
| 2017 | 11 | 14 |
| 2018 | 6 | 9 |
| 2019 | 12 | 13 |
| 2020 | 7 | 17 |
| 2021 | 11 | 9 |
| 2022 | 5 | 33 |
| 2023 | 14 | 15 |
| 2024 | 17 | 12 |
| 2025 | 12 | 8 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composition including reflective particles4 Aug 2026US 12,698,399 B2Viavi Solutions Inc.
- Electromagnetic wave shielding material, electronic component, and electronic apparatus31 Mar 2026US 12,593,430 B2FUJIFILM Corporation
- Complex magnetic composition, magnetic member, and electronic component24 Mar 2026US 12,586,701 B2TDK Corporation
- Magnetic sheet3 Mar 2026US 12,567,535 B2Tokin Corporation
- Low-loss inductor and manufacturing method thereof24 Feb 2026US 12,562,300 B2HONG DANG Technology Co., Ltd.
- Magnetic paste, circuit member, and method for manufacturing circuit member8 Oct 2026US 2026/0311919 A1
- Core piece, reactor, converter and power conversion device3 Sep 2026US 2026/0260795 A1Autonetworks Technologies, Ltd.
- Magneto-dielectric composite powder13 Aug 2026US 2026/0233432 A1Rogers Corporation
- Compound powder, molded body, cured product, and method for producing compound powder2 Jul 2026US 2026/0183839 A1Resonac Corporation
- Method for preparing high-fluidity magnetic composite material and preparation method thereof4 Jun 2026US 2026/0152624 A1Jiangxi Dayou Technology Co., Ltd.
Most cited
By later US patents
- Composite magnetic material and magnetic molding material, magnetic powder compression molding material, and magnetic paint using the composite magnetic material, composite dielectric material and molding material, powder compression molding material, paint, prepreg, and substrate using the composite dielectric material, and electronic part56US 7,060,350 B2TDK Corporation · 2006
- Composite magnetic body, and magnetic element and method of manufacturing the same37US 6,888,435 B2Matsushita Electric Industrial Co., Ltd. · 2005
- Composite magnetic article for electromagnetic interference suppressor32US 5,827,445 ATokin Corporation · 1998
- Magnetorheological fluids31US 6,932,917 B2General Motors Corporation · 2005
- Composite magnetic body, and magnetic element and method of manufacturing the same30US 6,784,782 B2Matsushita Electric Industrial Co., Ltd. · 2004