G05B 2219/49331
Laser drilling followed by laser cutting
G05B2219/49331 (Laser drilling followed by laser cutting) appears on 3 US grants and 2 published applications in this corpus.
Search patents in G05B- Granted patents
- 3
- Published applications
- 2
- Assignees
- 3
- Inventors
- 5
- Latest grant
- 20 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Processing program creation device, method for determining scattering direction of molten metal, laser processing machine, and laser processing method20 May 2025US 12,304,003 B2Amada Company, Limited
- Method and apparatus for laser piercing and cutting metal sheet and plate17 Aug 2004US 6,777,641 B2W.A. Whitney Co.
- Laser beam machining system and method using preliminary work commands7 Jul 1998US 5,777,294 AMitsubishi Denki Kabushiki Kaisha
- Processing program creation device, method for determining scattering direction of molten metal, laser processing machine, and laser processing method21 Jul 2022US 2022/0226933 A1Amada Company, Limited
- Method and apparatus for laser piercing and cutting metal sheet and plate16 Oct 2003US 2003/0192865 A1W.A. Whitney Co.
Most cited
By later US patents