G05B 2219/31065
Disassembly evaluation
G05B2219/31065 (Disassembly evaluation) appears on 10 US grants and 5 published applications in this corpus.
Search patents in G05B- Granted patents
- 10
- Published applications
- 5
- Assignees
- 8
- Inventors
- 36
- Latest grant
- 5 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Salvage metal cutting robot5 Aug 2025US 12,377,565 B2Worcester Polytechnic Institute
- Modular system for automated portable electronic device disassembly29 Jun 2021US 11,045,913 B1Apple Inc.
- Assembly and disassembly method, system, and component17 Nov 2015US 9,186,760 B2Telezygology, Inc.
- Circuit board router apparatus and method thereof7 Nov 2006US 7,131,800 B2Tyco Electronics Corporation
- Assembly and disassembly sequences of components in computerized multicomponent assembly models20 Apr 2004US 6,725,184 B1Wisconsin Alumni Research Foundation
- Salvage metal cutting robot20 Oct 2022US 2022/0332003 A1Worcester Polytechnic Institute
- Assembly order generation device and assembly order generation method28 Apr 2016US 2016/0116911 A1Hitachi, Ltd.
- Method and apparatus for investigation of how a technical system can be broken down7 May 2009US 2009/0119070 A1Daimler AG
- Assembly and disassembly method, system, and component7 Dec 2006US 2006/0272141 A1Telezygology, Inc.
- Circuit board router apparatus and method thereof12 May 2005US 2005/0100421 A1Tyco Electronics Corporation
Most cited
By later US patents
- Assembly and disassembly sequences of components in computerized multicomponent assembly models59US 6,725,184 B1Wisconsin Alumni Research Foundation · 2004
- Automatic manufacturing evaluation method and system40US 6,223,092 B1Hitachi, Ltd. · 2001
- Automatic manufacturability evaluation method and system31US 5,717,598 AHitachi, Ltd. · 1998
- Method of evaluating easiness of works and processings performed on articles and evaluation apparatus20US 5,907,488 AHitachi, Ltd. · 1999
- Method of evaluating easiness of works and processings performed on articles and evaluation apparatus14US 5,586,022 AHitachi, Ltd. · 1996