G05B 2219/25464
Mbo motherboard, backplane special layout
Official title: MBO motherboard, backplane special layout
G05B2219/25464 (Mbo motherboard, backplane special layout) appears on 5 US grants and 5 published applications in this corpus.
Search patents in G05B- Granted patents
- 5
- Published applications
- 5
- Assignees
- 6
- Inventors
- 11
- Latest grant
- 16 Jul 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Systems and methods for authenticating industrial automation components16 Jul 2024US 12,038,741 B2Rockwell Automation Technologies, Inc.
- Electronic equipment, system for protecting electronic equipment, method for controlling electronic equipment, and storage medium22 Feb 2022US 11,256,300 B2Beijing Xiaomi Mobile Software Co., Ltd.
- Industrial control device and method for insertion and removal of a module under power without interruption26 Sep 2017US 9,774,544 B2Rockwell Automation Asia Pacific Business Ctr. Pte., Ltd.
- Flexible system architecture with common interface for multiple system functions9 May 2006US 7,043,585 B2Sun Microsystems, Inc.
- I/O module with reduced isolation circuitry26 Dec 1995US 5,479,618 AAllen-Bradley Company, Inc.
- Systems and methods for authenticating industrial automation components30 Mar 2023US 2023/0095486 A1Rockwell Automation Technologies, Inc.
- Electronic equipment, system for protecting electronic equipment, method for controlling electronic equipment, and storage medium15 Apr 2021US 2021/0109571 A1Beijing Xiaomi Mobile Software Co., Ltd.
- Backplane-based plc system with hot swap function1 Aug 2019US 2019/0235465 A1Lsis Co., Ltd.
- Industrial control device and method for insertion and removal of a module under power without interruption30 Jun 2016US 2016/0191418 A1Rockwell Automation Asia Pacific Business Ctr. Pte., Ltd.
- Flexible system architecture with common interface for multiple system functions2 Oct 2003US 2003/0188067 A1Sun Microsystems, Inc.
Most cited
By later US patents
- I/O module with reduced isolation circuitry23US 5,479,618 AAllen-Bradley Company, Inc. · 1995
- Flexible system architecture with common interface for multiple system functions10US 7,043,585 B2Sun Microsystems, Inc. · 2006
- Industrial control device and method for insertion and removal of a module under power without interruption2US 9,774,544 B2Rockwell Automation Asia Pacific Business Ctr. Pte., Ltd. · 2017