F28F 2275/143
With pin and hole connections
Official title: with pin and hole connections
F28F2275/143 (With pin and hole connections) appears on 56 US grants and 37 published applications in this corpus.
Search patents in F28F- Granted patents
- 56
- Published applications
- 37
- Assignees
- 50
- Inventors
- 161
- Latest grant
- 12 Dec 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 1 |
| 2002 | 5 | 2 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 2 | 4 |
| 2007 | 0 | 1 |
| 2008 | 2 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 2 |
| 2012 | 0 | 2 |
| 2013 | 0 | 2 |
| 2014 | 2 | 3 |
| 2015 | 1 | 0 |
| 2016 | 1 | 1 |
| 2017 | 2 | 2 |
| 2018 | 0 | 2 |
| 2019 | 3 | 4 |
| 2020 | 2 | 5 |
| 2021 | 1 | 0 |
| 2022 | 1 | 2 |
| 2023 | 2 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Heat exchanger with an improved core support structure12 Dec 2023US 11,840,956 B2Hanon Systems
- Connection device for interconnecting two components made of plastics material5 Sep 2023US 11,746,809 B2Denso Thermal Systems S.P.A.
- Installation means for a device for treating a net fluid with a working fluid28 Jun 2022US 11,371,727 B2Hewitech GmbH & Co. KG
- Plate heat exchanger12 Jan 2021US 10,890,384 B2Alfa Laval Corporate AB
- Cooling module supporting structure27 Oct 2020US 10,816,281 B2Toyota Jidosha Kabushiki Kaisha
- Liquid-cooling radiator and heat pipe thereof13 Feb 2025US 2025/0052524 A1Accton Technology Corporation
- Heat exchanger with a mounting portion7 Sep 2023US 2023/0278416 A1Valeo North America, Inc.
- Heat exchanger7 Jul 2022US 2022/0213834 A1Hanon Systems
- Heat dissipation plate9 Jun 2022US 2022/0183179 A1Chicony Power Technology Co., Ltd.
- Connection device for interconnecting two components made of plastics material26 Nov 2020US 2020/0370577 A1Denso Thermal Systems S.P.A.
Most cited
By later US patents
- Microchannel apparatus, methods of making microchannel apparatus, and processes of conducting unit operations66US 6,989,134 B2Velocys, Inc. · 2006
- Radiator attachment structure49US 6,260,609 B1Honda Giken Kogyo Kabushiki Kaisha · 2001
- Resiliently mounted radiator assembly46US 4,579,184 AMazda Motor Corporation · 1986
- Radiator, charge air cooler and condenser mounting method40US 6,029,345 AAlliedSignal Inc. · 2000
- Installation element of an installed packing40US 8,834,058 B2GEA 2H Water Technologies GmbH · 2014