F28D 1/05366
Assemblies of conduits connected to common headers
Official title: {Assemblies of conduits connected to common headers, e.g. core type radiators}
F28D1/05366 (Assemblies of conduits connected to common headers) appears on 1,702 US grants and 2,374 published applications in this corpus.
Search patents in F28D- Granted patents
- 1,702
- Published applications
- 2,374
- Assignees
- 500
- Inventors
- 3,687
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 7 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 11 | 0 |
| 1991 | 11 | 0 |
| 1992 | 21 | 0 |
| 1993 | 23 | 0 |
| 1994 | 22 | 0 |
| 1995 | 12 | 0 |
| 1996 | 19 | 0 |
| 1997 | 9 | 0 |
| 1998 | 16 | 0 |
| 1999 | 23 | 0 |
| 2000 | 21 | 0 |
| 2001 | 37 | 12 |
| 2002 | 18 | 35 |
| 2003 | 18 | 27 |
| 2004 | 20 | 46 |
| 2005 | 35 | 70 |
| 2006 | 40 | 79 |
| 2007 | 34 | 99 |
| 2008 | 28 | 108 |
| 2009 | 26 | 84 |
| 2010 | 37 | 81 |
| 2011 | 40 | 108 |
| 2012 | 39 | 59 |
| 2013 | 35 | 77 |
| 2014 | 40 | 100 |
| 2015 | 42 | 114 |
| 2016 | 52 | 113 |
| 2017 | 87 | 103 |
| 2018 | 96 | 128 |
| 2019 | 119 | 115 |
| 2020 | 98 | 137 |
| 2021 | 89 | 119 |
| 2022 | 94 | 155 |
| 2023 | 97 | 126 |
| 2024 | 112 | 124 |
| 2025 | 98 | 97 |
| 2026 | 48 | 58 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
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- Evaporative condenser15 Sep 2026US 12,736,258 B2Kyungdong Navien Co., Ltd.
- Heat exchanger and refrigeration cycle apparatus8 Sep 2026US 12,729,915 B2Mitsubishi Electric Corporation
- Heat exchanger, refrigeration cycle apparatus, and method for manufacturing heat exchanger8 Sep 2026US 12,729,920 B2Mitsubishi Electric Corporation
- Manifold fluid module1 Sep 2026US 12,723,817 B2Hanon Systems
- Heat exchanger8 Oct 2026US 2026/0309428 A1Hanon Systems
- Air cooled heat exchanger with intermediate airflow module24 Sep 2026US 2026/0287265 A1Evapco, Inc.
- Heat exchanger and air conditioner employing the same10 Sep 2026US 2026/0266565 A1Samsung Electronics Co., Ltd.
- Fin, heat exchanger and water heater3 Sep 2026US 2026/0259013 A1Guangdong Midea Kitchen and Bath Appliances Mfg. Co., Ltd.
- Heat exchanger, heat dissipation module, and compute device27 Aug 2026US 2026/0251398 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Heat exchanger141US 6,964,296 B2Modine Manufacturing Company · 2005
- Electronic enclosure cooling system115US 4,911,231 ABICC Public Limited Company · 1990
- Extruded manifold with multiple passages and cross-counterflow heat exchanger incorporating same103US 5,941,303 AThermal Components, Inc. · 1999
- Heat and mass exchanger94US 7,269,966 B2AIL Reasearch, Inc. · 2007
- Heat exchanger with oblong grommetted tubes and locating plates91US 5,538,079 A1996