F25B 2500/21
Reduction of parts
F25B2500/21 (Reduction of parts) appears on 17 US grants and 20 published applications in this corpus.
Search patents in F25B- Granted patents
- 17
- Published applications
- 20
- Assignees
- 19
- Inventors
- 43
- Latest grant
- 10 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 2 |
| 2005 | 2 | 4 |
| 2006 | 2 | 3 |
| 2007 | 1 | 0 |
| 2008 | 2 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 2 |
| 2020 | 2 | 1 |
| 2021 | 0 | 2 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ejector refrigeration circuit10 Dec 2024US 12,163,705 B2Carrier Corporation
- Modular arrangement for use in a vapor-compression refrigeration system17 Oct 2023US 11,788,780 B2Mayekawa Europe NV/SA
- Refrigerant transfer control in multi mode air conditioner with hot water generator3 Nov 2020US 10,823,471 B2Carrier Corporation
- Ammonia and hydrogen electrochemical climate control systems22 Sep 2020US 10,782,050 B2Emerson Climate Technologies, Inc.
- Resin bonded sorbent29 Sep 2009US 7,595,278 B2Multisorb Technologies, Inc.
- Integrated cooling module17 Sep 2026US 2026/0276266 A1Hanon Systems
- Compressor arrangement for hvac&r system27 Aug 2026US 2026/0251357 A1Tyco Fire & Security GmbH
- Air conditioning system30 Jan 2025US 2025/0035331 A1Carrier Corporation
- Multi-stage air handling unit for linear capacity output23 Nov 2023US 2023/0375241 A1Siemens Industry, Inc.
- Ejector refrigeration circuit11 Nov 2021US 2021/0348810 A1Carrier Corporation
Most cited
By later US patents
- Bi-directional refrigerant expansion and metering valve20US 6,199,399 B1American Standard Inc. · 2001
- Expansion valve19US 7,222,502 B2Fujikoki Corporation · 2007
- Fluid diode expansion device for heat pumps18US 7,043,937 B2Carrier Corporation · 2006
- Laminated heat exchanger15US 5,724,817 AZexel Corporation · 1998
- Combined unit of expansion valve and reservoir tank12US 5,799,499 AFujikoki Corporation · 1998