E04F 15/085

The lower layer being of fibrous or chipped material

Official title: {The lower layer being of fibrous or chipped material, e.g. bonded with synthetic resins}

E04F15/085 (The lower layer being of fibrous or chipped material) appears on 29 US grants and 34 published applications in this corpus.

Search patents in E04F
Granted patents
29
Published applications
34
Assignees
26
Inventors
43
Latest grant
14 Apr 2026

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E04F 15/085: granted patents and published applications per publication year
YearGranted patentsPublished applications
198310
198400
198500
198600
198700
198800
198900
199000
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199300
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200601
200720
200811
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201110
201200
201310
201412
201513
201600
201722
201840
201903
202012
202122
202255
202313
202421
202522
202622

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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