E04F 11/1042

With an upper layer of fibres or chips

Official title: {with an upper layer of fibres or chips, e.g. bonded with synthetic resins}

E04F11/1042 (With an upper layer of fibres or chips) appears on 4 US grants and 4 published applications in this corpus.

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Granted patents
4
Published applications
4
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3
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3
Latest grant
1 Nov 2022